TECHNICAL PARAMETERS:

Inspection Principle:Programmable phase contour modulation measurement techniques(PSLM PMP)

Inspection type:Volume, area, height, XY offset, shape, etc.

Defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component: 01005.

Accuracy: XY=10 um,Height = 0.37 um.

Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.

Maximum Loading PCB Size(X*Y): 470x470mm.

Inspection Speed: 0.42 SEC/FOV.

FiducialDetection Time: 0.3sec/piece.

Maximum inspection height:±450um.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic contour with coaxial telecentric lens perfect processing flexible circuit board testing.

Barcode function with traceability.

Badmark transfer function to mounters.

Access IMS system functions.

Operating System Support: Windows 10 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.