TECHNICAL PARAMETERS:

Inspection Principle: Sine white projection PMP inspection

Defect inspections: Missing parts, offset, rotation, three-dimensional polarity, upside down, OCV , side standing, tombstone, poor soldering, etc.

Solder inspection: Solder tip, solder volume percentage, excessive solder, insufficient solder, bridge, hole plugging, solder filet, pad contamination, etc.

Smallest component: 01005.

Accuracy: XY (Resolution)：10um.

Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.

Maximum Loading PCB Size(X*Y): 450x450mm.

Inspection Speed: 0.45 SEC/FOV.

Mark-point Detection Time: 0.5sec/piece.

MaximuminspectionHight: 10mm.

Maximum height of component on PCB: 50mm.

MaximumPCB Warpage: ±5mm.

Operating System Support: Windows 10 Professional (64 bit).

Equipment Dimension and weight: W1000xD1174xH1550.