TECHNICAL PARAMETERS:

Inspection Principle: Programmable phase contour modulation measurement techniques(PSLM PMP)

Inspection type:Volume, area, height, XY offset, shape, etc.

Detection of defect Types:shift, excessive solder, insufficient solder, offset, deformed shape, etc.

Smallest component size: 008004.

XY positioning accuracy：1um Grating ruler.

Repeatability: height：≤1um （4 Sigma）;volume/acreage：<1%（4 Sigma）.

Maximum Loading PCB Size(X*Y): 450x450mm.

Inspection Speed: 0.3 SEC/FOV.

Fiducial mark Detection Time: 0.5sec/piece.

Maximum inspection component height:±550um （±1200umOption）.

High precision industrial camera with high frame count.

RGB Tune patented technology.

D-lighting patented technology.

Dynamic copying function and static anti-warping function.

Barcode function with traceability .

Badmark function with mounters.

Closed loop function with printer

Access MES system functions.

Operating System Support: Windows 10 Professional (64 bit).

Five-minute programming, one-click operation.

SPC process control.