As a global heavyweight event in SiP,the event focuses on new technologies and market dynamics in the advanced packaging and testing field, including wafer manufacturing, IC testing, and end-product manufacturing, and covers all aspects of electronic system design, advanced packaging expertise, and SiP design chains. It also brings together OSAT, EMS, OEM, IDM, non-wafer semiconductor design companies, silicon wafer foundries, and assembly and test suppliers of raw materials and equipment, fully promoting the integration, interaction, and innovative development of the IC design, packaging, 5G, and AI industry chains.

SiP Conference China 2023 was successfully held from August 23 to 25, 2023 in Hall 9 of Shenzhen Convention and Exhibition Center (Futian). Xiamen SINICTEK Intelligent Technology Co., Ltd. exhibited 3DSPI & 3DAOI products, attracting many guests to visit and exchange ideas, thanks for visiting, The conference has come to a perfect conclusion and we look forward to meeting you again.

Wonderful moments